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Intel's contract manufacturing business faces potential setback after Broadcom tests disappoint - report

Intel's (NASDAQ:INTC) contract manufacturing business has potentially seen a setback after tests with Broadcom (AVGO) failed, Reuters reported, citing people with knowledge of the matter. Broadcom's ...
The Business Journals

Intel's new silicon wafer fails recent Broadcom test, reports say

To continue reading this content, please enable JavaScript in your browser settings and refresh this page. Preview this article 1 min Intel is facing another setback ...
TweakTown

Intel wants to secure Microsoft, Tesla, Qualcomm, and NVIDIA as advanced packaging customers

Intel is reportedly marketing its advanced packaging services to companies like Microsoft, Tesla, Qualcomm, and NVIDIA from ...
MarketWatch

Will Intel give up on chip manufacturing? Here’s how that could have big ripple effects.

Intel Corp. recently indicated that it might give up on its next-generation chip technologies, and some analysts said it could signal a future where the chip maker doesn’t have its chip fabrication ...
Fudzilla

Intel spies a fresh payday in fancy packaging

US customers eye local options Advanced packaging is shaping up to be a massive prospect for Troubled Chipzilla as US chip ...
Guru3D

Intel Panther Lake Prototypes Surface With Visible Core Layout

Fresh details about Intel’s Panther Lake platform are starting to land, thanks to a new Compute Tile die shot published by Chips and Cheese. The sample was built on Intel’s 18A node, the process Intel ...
The Business Journals

Broadcom fails Intel's silicon wafer, reports say

To continue reading this content, please enable JavaScript in your browser settings and refresh this page. Preview this article 1 min Intel's wafers — foot-wide ...